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As an ASIC Implementation Specialist in our Global Hardware R&D team, you’ll help expand IMC’s ASIC capabilities, building on our existing technology to accelerate time-to-market. You’ll work on greenfield projects spanning cutting-edge research and production-scale implementations,
The Package Innovation (PI) department is an organization within NXPs Corporate Technology Office that develops advanced semiconductor packaging solutions and next-generation packaging technologies across all NXP product lines. The Package Design team is a centralized global
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