About Us QuantWare is building the world’s most powerful quantum processors to solve humanitys greatest challenges. We do this with our unique VIO technology, the only QPU architecture that breaks the hardware barriers that have held
The Package Innovation (PI) department is an organization within NXPs Corporate Technology Office that develops advanced semiconductor packaging solutions and next-generation packaging technologies across all NXP product lines. The Package Design team is a centralized global function responsible for
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: 3D metrology spanning the chip from nanometer-scale transistors to micron-level die-interconnects; macro defect inspection of wafers
Join our cutting-edge start-up adventure! Who are we? Join the Revolution in GNSS and IoT Connectivity At Qualinx, we’re not just building chips, we’re engineering the future fabric of the connected world. As a pioneering semiconductor scale-up,
Job Mission As Principal Infrastructure Researcher, you are responsible for defining, developing, and realizing the infrastructure required for advanced hybrid bonding research focused on the impact on the requirements of future lithography tools. You will establish
For BL-SCE, Health Segment, NXP is looking for a high level Analog IC Design engineer (location Eindhoven). The NXP Personal Health domain, largely based in Leuven, develops IC’s for use in “Hearing Aids and Implants”, “Personal
Ben jij een ervaren Lead Mechanical Engineer met een passie voor high-tech machinebouw en Advanced Packaging technologie? In Beuningen zoeken we een technisch leider die mechanische concepten ontwerpt voor next-generation verpakkingsmachines, specifiek gericht op nauwkeurigheid en throughput.