Ready to join the future of innovation? NXP Automotive Radar product line is expanding its leadership position and providing ground-breaking and innovative products & solutions to the Automotive Market. Significant technical challenges must be overcome to
This is your new job: In this role you will be part of our BG IC Solutions development team, you will take ownership of the ESD requirements and implementations for integrated circuits developed by IC design
Job Description R&D Value Creation Packaging Intern Start date: September 2026 Duration: 6 months Platform/Project: Packaging Value Creation Intern During your assignment, you will be part of the D&EM (Developed and Emerging Markets) R&D team. You’ll
Company:Qualcomm Technologies Netherlands B.V. Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Role Overview We are looking for a RF front-end (RFFE) System Feature Engineer to contribute to the development, testing, and optimization of advanced modem features across